| 2025/07/17 |
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PCN(产品规格变更通知)
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PCN No. CENO-28UUSH311 Change Desc. Qualification of CuPdAu as an additional wire material for selected PIC32CM2532xx, PIC32CM5164xx, PIC32CM1602xx, PIC32CM3204xx, PIC32CM6408xx, ATSAMD20J1xx, ATSAMD21J1xx, ATSAML21J1xx, ATSAML22J1xx, ATSAMC20J1xx and ATSAMC21J1xx device families available in 64L VQFN (9x9x1.0mm) and 64L QFN (9x9x0.9mm) packages at MMT assembly site. |
| 2025/07/22 |
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PCN(产品规格变更通知)
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PCN No.: CENO-16EGCZ399 Description: CCBs 7684, 7686, 7703, 7704, 6429.001 and 7042.001 Final Notice: Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites. *As there are many affected products, we will inform you the model numbers by divided notifications. This is the 9/9th notification. |