| 2024/12/10 |
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PCN(产品规格变更通知)
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Supplier Notice No.:20240910001.1 Title: Qualification of RFAB using qualified Process Technologies, Die Revision, additional Assembly site (CDAT) and BOM options for select devices
Description of Change: Texas Instruments is pleased to announce the qualification of its RFAB fabrication facilities as additional Wafer Fab options in addition to a new assembly site (CDAT), & BOM options for the devices listed below. Additional Fab Site:RFAB Process:LBC7 Wafer Diameter:300 mm
Reason for Change: These changes are part of our multiyear plan to transition products from our 150-millimeter and 200-millimeter factories to newer, more efficient manufacturing processes and technologies, underscoring our commitment to product longevity and supply continuity.
Anticipated impact on Form, Fit, Function, Quality or Reliability (positive /negative): None |