| 2020/09/08 |
|
PCN(Product Change Notice)
|
PRODUCT CHANGE NOTIFICATION |
| 2020/09/09 |
|
PCN(Product Change Notice)
|
PRODUCT CHANGE NOTIFICATION |
| 2020/10/01 |
|
PCN(Product Change Notice)
|
MCU/SOC (GP products) announcement of Full carton |
| 2021/04/01 |
|
PCN(Product Change Notice)
|
RE-PROCESSED to include LTB Date to 4/01/2021 for packing change from Fractional Tray to Full Carton : Shipments from REA of devices in Full Cartons begins. October 1, 2020 |
| 2021/04/01 |
|
PCN(Product Change Notice)
|
RE-PROCESSED to include LTB Date to 4/01/2021 for packing form with a tray from fraction to Full Carton (full packing) : Full Carton shipment will become standard, combining max. 3 lot codes worst case |
| 2023/07/19 |
|
PCN(Product Change Notice)
|
The assembly and testing base: Renesas Semiconductor (Beijing) Co., Ltd (RSB) Changes: Die-bonding material will be changed. The new material are proven in assembly at RSB.
Effective Date: 10/16/2023 |
| 2023/10/01 |
|
PCN(Product Change Notice)
|
Die-bonding materials will be changed for assembly location RSB (Renesas Semiconductor (Beijing) Co., Ltd). The new materials are already proven and used for other products in RSB assembly. |
| 2025/09/01 |
|
PCN(Product Change Notice)
|
Notice of Change of Lead Frame for RA6M2/RA6M3/S3A3/S5D5/S5D9 Series LFQFP Package Products |
| 2025/09/01 |
|
PCN(Product Change Notice)
|
NOTICE OF CHANGE OF LEAD FRAME FOR RA6M2/RA6M3/S3A3/S5D5/S5D9 SERIES LFQFP PACKAGE PRODUCTS |