| 2024/06/19 |
|
PCN (Product Change Notice)
|
Supplier Notice No.:INF_024_24 Title: Moisture Barrier Bag and Anti-Static shielding bag elimination for MSL1 devices at Tijuana, Mexico.
Reason: Standardization of packing material for MSL1 devices at Tijuana, Mexico.
Description: Packing material & method:Old/ ? Moisture Barrier Bag +Humidity Indicator Card +Desiccant + Dry Pack and ? Anti-Static shielding bag + Dry Pack
Packing material & method:New/ ? Reel in packing box without Dry Pack
Impact of change: No impact on electrical performance as the change belongs to the standardization of packing material and method for MSL1 devices.
Intended start of delivery: 2024-06-19 |
| 2024/06/19 |
|
PCN (Product Change Notice)
|
Supplier Notice No.:024/24 Title: Moisture Barrier Bag and Anti-Static shielding bag elimination for MSL1 devices at Tijuana, Mexico
Description: Packing material & method/Old ? Moisture Barrier Bag + Humidity Indicator Card +Desiccant + Dry Pack and ? Anti-Static shielding bag +Dry Pack
Packing material & method/New ? Reel in packing box without Dry Pack
Impact of change: No impact on electrical performance as the change belongs to the standardization of packing material and method for MSL1 devices.
Intended start of delivery: 2024-06-19 |
| 2024/07/30 |
|
PCN (Product Change Notice)
|
Supplier Notice No.:2024-112-A Title: Change of the wafer production location from Infineon Technologies Temecula, USA and EPISIL Technologies Inc., Taiwan to Sichuan Gen Microelectronics co.LTD, China for dedicated GEN5 and GEN7 N-Channel MOSFET products.
Reason: The wafer production of the affected products will be transferred to Sichuan Gen Microelectronics co.LTD, China, according to global Infineon production strategy
Description: Wafer Fab Location/Old ? Infineon Technologies Temecula, USA ? EPISIL Technologies Inc., Taiwan Wafer Fab Location/New ? Sichuan Gen Microelectronics co.LTD, China
Impact of change: No
Intended start of delivery: 2024-07-30 or earlier based on customer approval |