| 2021/07/29 |
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PCN (Product Change Notice)
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Die redesign: Mask or mask set change with new die design - Design changes in active elements. Manufacturing Location TSMC Fab14 (Taiwan)/ Crolles (France)
Old Current Die revision: - STM32F46X 1MB rev2 (Cut 1.3) in ST Crolles CRL300 (France) - STM32F46X 1MB rev4 (Cut 1.3) in TSMC Fab14 (Taiwan) Current RM0090 Rev 8 - Reference Manual STM32F405/415, STM32F407/417, STM32F427/437 and STM32F429/439 advanced ArmR-based 32-bit MCUs
New New Die Revision to improve manufacturing efficiency: - STM32F46X 1MB rev6 (Cut 1.4) in ST Crolles CRL300 (France) - STM32F46X 1MB rev5 (Cut 1.4) in TSMC Fab14 (Taiwan) New RM0090 Rev 19 - Reference Manual - february 2021 STM32F405/415, STM32F407/417, STM32F427/437 and STM32F429/439 advanced ArmR-based 32-bit MCUs
Timing / schedule Date of qualification results 2021-05-14 Intended start of delivery 2021-12-22 |
| 2021/08/30 |
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PCN (Product Change Notice)
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- Specification Change OLD Refer to application Note AN2606 version 48.0 April 2021 : - STM32F40xxx/41xxx devices in WLCSP90 package have Bootloader version V9.0. - STM32F40xxx/41xxx devices in all other packages have Bootloader version V3.1.
NEW Refer to application Note AN2606 version 49.0 July 2021 : - All STM32F40xxx/41xxx devices in any package with new BootLoader version V9.1 |
| 2021/08/30 |
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PCN (Product Change Notice)
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STM32F46X 1MB product BootLoader improvement Product Category: STM32F46X 1MB Issue date 2021-07-13 Description Old Refer to application Note AN2606 version 48.0 April 2021 : - STM32F40xxx/41xxx devices in WLCSP90 package have Bootloader version V9.0. - STM32F40xxx/41xxx devices in all other packages have Bootloader version V3.1.
New Refer to application Note AN2606 version 49.0 July 2021 : - All STM32F40xxx/41xxx devices in any package with new BootLoader version V9.1
Intended start of delivery 2021-08-30 |
| 2021/08/30 |
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PCN (Product Change Notice)
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Specification Change STM32F46X 1MB product BootLoader improvement Description Refer to application Note AN2606 version 49.0 July 2021 - All STM32F40xxx/41xxx devices in any package with new BootLoader version V9.1 Intended start of delivery 2021-08-30 |
| 2021/12/22 |
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PCN (Product Change Notice)
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Die redesign: Mask or mask set change with new die design - Design changes in active elements.
Description of change: OLD: Current Die revision: - STM32F46X 1MB rev2 (Cut 1.3) in ST Crolles CRL300 (France) - STM32F46X 1MB rev4 (Cut 1.3) in TSMC Fab14 (Taiwan) Current RM0090 Rev 8 - Reference Manual STM32F405/415, STM32F407/417, STM32F427/437 and STM32F429/439 advanced ArmR-based 32-bit MCUs. New: New Die Revision to improve manufacturing efficiency: - STM32F46X 1MB rev6 (Cut 1.4) in ST Crolles CRL300 (France) - STM32F46X 1MB rev5 (Cut 1.4) in TSMC Fab14 (Taiwan) New RM0090 Rev 19 - Reference Manual -february 2021 STM32F405/415, STM32F407/417, STM32F427/437 and STM32F429/439 advanced ArmR-based 32-bit MCUs
Intended start of delivery 2021-12-22 |
| 2022/05/08 |
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PCN (Product Change Notice)
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NEW DISTRIBUTION CENTER Notification related to 2nd EMEA DC project in Frankfurt Timing / schedule Intended start of delivery 2022-05-08 |