| 2022/04/24 |
|
PCN (Product Change Notice)
|
Setup of a 2nd EMEA DC in Frankfurt for closer deliveries to customers in Germany & Eastern Europe. The change also includes personnel, location, logistic model.. |
| 2022/05/08 |
|
PCN (Product Change Notice)
|
NEW DISTRIBUTION CENTER Notification related to 2nd EMEA DC project in Frankfurt Timing / schedule Intended start of delivery 2022-05-08 |
| 2022/05/15 |
|
PCN (Product Change Notice)
|
Notification related for 2nd EMEA DC project in Frankfurt |
| 2025/02/17 |
|
PCN (Product Change Notice)
|
Supplier Notice No.:MDG/24/14375#1 Title: AMKOR ATP (Philippines) TFBGA package copper palladium bonding wire introduction on STM32F4x, STM32F7x, STM32G4x and STM32H7x listed products.
Description of change: (Updated document) Old/ Current Wire bonding material: - MUAR (Malaysia) gold wire - ASE Kaohsiung (Taiwan) Gold or CuPd wire - AMKOR ATP (Philippines) gold wire
New/ Current Wire bonding material: - MUAR (Malaysia) gold wire - ASE Kaohsiung (Taiwan) Gold or CuPd wire - AMKOR ATP (Philippines) gold wire New Wire bonding material : - AMKOR ATP (Philippines) copper palladium wire
Anticipated Impact on form,fit,function, quality, reliability or processability? no impact on form, Fit, Function
Intended start of delivery: 2025-02-17 |
| 2025/07/03 |
|
PCN (Product Change Notice)
|
PCN No.:MICROCONTROLLERS/25/15246 Change Desc.:Generic communication - Enhanced traceability with 2D marking for STM32 and STM8 listed products(1/3)
old/ Marking composition with no 2D marking
New/ New marking composition with 2D marking for production assembly |
| 2025/07/18 |
|
PCN (Product Change Notice)
|
PCN No. CRP/25/15294 Change Desc. Additional 2D in ST Standard Inner Bulk Label (MDRF perimeter)
Timing / schedule Intended start of delivery 2025-08-18 |
| 2025/11/04 |
|
PCN (Product Change Notice)
|
Supplier Notice No.:MICROCONTROLLERS/25/15305 Title:ST ROUSSET (France) additional source for STM32F411x , STM32F412x and STM32F76x/F77x listed products in M10/90nm technology.
Type of change: Line transfer for a full process or process brick(process step, control plan, recipes) from one site to another site: Wafer fabrication (SOP 2617)
Manufacturing Location: ST Rousset (France)
Anticipated Impact on form,fit, function, quality, reliability or processability? No change on Form, Fit or Function - same datasheets
Intended start of delivery: 2025-11-04 |
| 2025/11/07 |
|
PCN (Product Change Notice)
|
PCN No.: EMBEDDED PROCESSING/25/15422 Description: ASE KaoHsiung (Taiwan) additional source for STM32F74/75xx, STM32F76/77xx listed products in TFBGA 13X13 216L package and STM32F20/21xx, STM32F40/41xx, STM32F42/43xx listed products in UFBGA 10X10 176+25 package. |