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PCN/PDN/NRND Information

PCN (product/process change notification) and PDN (production discontinuation notification) information.

Notification Date Notification Documents Notification Type Notification Information
2022/04/24 PCN (Product Change Notice) Setup of a 2nd EMEA DC in Frankfurt for closer deliveries to customers in
Germany & Eastern Europe. The change also includes personnel, location,
logistic model..
2022/05/08 PCN (Product Change Notice) NEW DISTRIBUTION CENTER
Notification related to 2nd EMEA DC project in Frankfurt
Timing / schedule
Intended start of delivery 2022-05-08
2022/05/15 PCN (Product Change Notice) Notification related for 2nd EMEA DC project in Frankfurt
2025/02/17 PCN (Product Change Notice) Supplier Notice No.:MDG/24/14375#1
Title:
AMKOR ATP (Philippines) TFBGA package copper palladium bonding wire introduction on STM32F4x, STM32F7x, STM32G4x and STM32H7x listed products.

Description of change:
(Updated document)
Old/
Current Wire bonding material:
- MUAR (Malaysia) gold wire
- ASE Kaohsiung (Taiwan) Gold or CuPd wire
- AMKOR ATP (Philippines) gold wire

New/
Current Wire bonding material:
- MUAR (Malaysia) gold wire
- ASE Kaohsiung (Taiwan) Gold or CuPd wire
- AMKOR ATP (Philippines) gold wire
New Wire bonding material :
- AMKOR ATP (Philippines) copper palladium wire

Anticipated Impact on form,fit,function, quality, reliability or processability?
no impact on form, Fit, Function

Intended start of delivery:
2025-02-17
2025/07/03 PCN (Product Change Notice) PCN No.:MICROCONTROLLERS/25/15246
Change Desc.:Generic communication - Enhanced traceability with 2D marking for STM32 and STM8 listed
products(1/3)

old/
Marking composition with no 2D marking

New/
New marking composition with 2D marking for
production assembly
2025/07/18 PCN (Product Change Notice) PCN No. CRP/25/15294
Change Desc.
Additional 2D in ST Standard Inner Bulk Label (MDRF perimeter)

Timing / schedule Intended start of delivery 2025-08-18
2025/11/04 PCN (Product Change Notice) Supplier Notice No.:MICROCONTROLLERS/25/15305
Title:ST ROUSSET (France) additional source for STM32F411x , STM32F412x and STM32F76x/F77x listed products in M10/90nm technology.

Type of change:
Line transfer for a full process or process brick(process step, control plan, recipes) from one site to another site: Wafer fabrication (SOP 2617)

Manufacturing Location:
ST Rousset (France)

Anticipated Impact on form,fit, function, quality, reliability or processability?
No change on Form, Fit or Function - same datasheets

Intended start of delivery:
2025-11-04
2025/11/07 PCN (Product Change Notice) PCN No.: EMBEDDED PROCESSING/25/15422
Description: ASE KaoHsiung (Taiwan) additional source for STM32F74/75xx, STM32F76/77xx listed products in TFBGA 13X13 216L package and STM32F20/21xx, STM32F40/41xx, STM32F42/43xx listed products in UFBGA 10X10 176+25 package.
Click here for contact regarding final purchasing
PCN/PDN/NRND Information
Notification Type
Notification Information
Notification Date
Products subject to notification
Manufacturer Manufacturer Part Number Last Time Buy Successor Products

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