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PCN/PDN/NRND Information

PCN (product/process change notification) and PDN (production discontinuation notification) information.

Notification Date Notification Documents Notification Type Notification Information
2021/01/27 PCN (Product Change Notice) Change of wafer production location from Infineon Technologies Temecula, USA
to EPISIL Technologies Inc., Taiwan for several Gen5.0 and Gen 7.0 MOSFET
2021/01/29 PCN (Product Change Notice) Change of wafer production location from Infineon Technologies Temecula,
USA to EPISIL Technologies Inc., Taiwan for several Gen5.0 and Gen 7.0
MOSFET
2021/02/26 PCN (Product Change Notice) Manufacturer: Infineon Ref# : 1114-DISTI42-C4000343-PRIVATE
Subject: INTRODUCTION OF TONGFU MICROELECTRONICS AS ALTERNATE ASSEMBLY SITE FOR TO220 MOSFET PRODUCTS
2021/03/21 PCN (Product Change Notice) Capacity expansion with introduction of an additional assembly and final
test location at Huayi Microelectronics Co., Ltd (HYME), China for dedicated
TO220 3L MOSFET products in Gen 5.X/7.X/10.X
2021/08/15 PCN (Product Change Notice) Harmonize and standardize the lot number format across all external production partners
Old : Multiple lot number formats
New : Standardized into a single 11 alphanumeric lot number format
2023/12/11 PCN (Product Change Notice) Phase out of Kyocera KEG300 mold compound for several assembly
locations and change of lead finish from tin dip to electro plating at
Tijuana, Mexico for dedicated TO220-3 & TO247-3 products
Reason
To ensure continuity of mold compound supply due to Kyocera
KEG300 end of life and to further ensure our product performance
with lead-free electroplating finish
Description
Assembly materials:Mold compound
Old: Kyocera KEG300
New: Sumitomo EME-E500
Assembly materials:Lead finish (Tijuana only)
Old: Tin dip finish
New: Lead-free electroplating finish

Intended start of delivery 2024-02-29
2024/02/01 PCN (Product Change Notice) Supplier Notice No.:PCN 2023-092-A
Title:
Change of the wafer production location from Infineon Technologies Temecula, USA to Infineon Technologies Kulim, Malaysia for dedicated G5 P-Channel MOSFET products

Reason:
The wafer production of the affected products will be extended to Infineon Technologies Kulim, according to global Infineon production strategy

Impact of change:
No

Intended start of delivery:
February 2024 or based on customer approval
2024/02/29 PCN (Product Change Notice) Phase out of Kyocera KEG300 mold compound for several assembly locations and change of lead finish from tin dip to electro plating at Tijuana, Mexico for dedicated TO220-3 & TO247-3 products
2024/04/15 PCN (Product Change Notice) Supplier Notice No.:2023-092-B
Title:
Change of the wafer production location from Infineon TechnologiesTemecula, USA to Infineon Technologies Kulim, Malaysia for dedicated G5 P-Channel MOSFET products.

Reason:
The wafer production of the affected products will be extended to Infineon Technologies Kulim, according to global Infineon production strategy.

Impact of change:
NO

Intended start of delivery:
2024-04-15
Click here for contact regarding final purchasing
PCN/PDN/NRND Information
Notification Type
Notification Information
Notification Date
Products subject to notification
Manufacturer Manufacturer Part Number Last Time Buy Successor Products

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