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PCN/PDN/NRND Information

PCN (product/process change notification) and PDN (production discontinuation notification) information.

Notification Date Notification Documents Notification Type Notification Information
2021/03/21 PCN (Product Change Notice) Capacity expansion with introduction of an additional assembly and final
test location at Huayi Microelectronics Co., Ltd (HYME), China for dedicated
TO220 3L MOSFET products in Gen 5.X/7.X/10.X
2021/11/15 PCN (Product Change Notice) Removal of legacy International Rectified (IR) logo from tube
and packing box affecting products from assembly location Rectificadores
Internacionales, S.A. de C.V., Tijuana , Mexico.
Reason: Standardization of packing material across Infineon sites

Description
Old: Outer packing box and plastic tube with legacy IR logo
New: Legacy IR logo removed from packing box and plastic tube
2023/12/11 PCN (Product Change Notice) Phase out of Kyocera KEG300 mold compound for several assembly
locations and change of lead finish from tin dip to electro plating at
Tijuana, Mexico for dedicated TO220-3 & TO247-3 products
Reason
To ensure continuity of mold compound supply due to Kyocera
KEG300 end of life and to further ensure our product performance
with lead-free electroplating finish
Description
Assembly materials:Mold compound
Old: Kyocera KEG300
New: Sumitomo EME-E500
Assembly materials:Lead finish (Tijuana only)
Old: Tin dip finish
New: Lead-free electroplating finish

Intended start of delivery 2024-02-29
2024/02/29 PCN (Product Change Notice) Phase out of Kyocera KEG300 mold compound for several assembly locations and change of lead finish from tin dip to electro plating at Tijuana, Mexico for dedicated TO220-3 & TO247-3 products
2024/07/30 PCN (Product Change Notice) Supplier Notice No.:2024-112-A
Title:
Change of the wafer production location from Infineon Technologies Temecula, USA and EPISIL Technologies Inc.,
Taiwan to Sichuan Gen Microelectronics co.LTD, China for dedicated GEN5 and GEN7 N-Channel MOSFET products.

Reason:
The wafer production of the affected products will be transferred to Sichuan Gen Microelectronics co.LTD, China, according to global Infineon production strategy

Description:
Wafer Fab Location/Old
? Infineon Technologies Temecula, USA
? EPISIL Technologies Inc., Taiwan
Wafer Fab Location/New
? Sichuan Gen Microelectronics co.LTD, China

Impact of change:
No

Intended start of delivery:
2024-07-30 or earlier based on customer approval
Click here for contact regarding final purchasing
PCN/PDN/NRND Information
Notification Type
Notification Information
Notification Date
Products subject to notification
Manufacturer Manufacturer Part Number Last Time Buy Successor Products

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