| 2022/04/16 |
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PCN (Product Change Notice)
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Introduction of new Epoxy Mold Compounds EMC in SOT23 package |
| 2022/08/01 |
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PCN (Product Change Notice)
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Introduction of additional EMCs (epoxy mold compounds) GR646CHN, CV4112 and EME-E500HK in SOT23 package. Effective date: 14 Jul 2022 |
| 2024/01/07 |
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PCN (Product Change Notice)
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Introduction of new carrier tape material in SOT23 A new surface material for carrier tapes for the package SOT23 will be introduced as second source: Polystyrene (PS) in addition to Polycarbonate (PC). The cover tape material will remain unchanged.
Since there are many applicable products, this notification is divided into individual notifications. Depending on your company's purchase history, you may receive multiple notifications. Please be aware. |
| 2024/06/15 |
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PCN (Product Change Notice)
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Nexperia changes the finished goods label, this includes: - Readable text~orderable part number (OPN) on SPQ and PQ labels, (34P) - 2D matrix code on SPQ~label, embedded with packing unit identifier (PUID) data - Replace (31D) Redate~by (32D) Date1 for new re-date code definition - QR code on PQ label (for~internal use mainly) * Since there are many applicable products, this notification is divided and notified. Therefore, depending on your purchase history, notifications may be sent in multiple notifications, but the following notifications will all be the same. Our notification number: PP0000735569 / PP0000735597 |
| 2025/05/04 |
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PCN (Product Change Notice)
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Supplier Notice No.:CN-202411017F Title: New die-layout and -size of switching transistors
Details of this change The following changes are affected: - Die Design (please see the SQR) - Die shrink from 280 x 280 μm2, 400 x 400 μm2 and 370 x 350 μm2 to 260 x 260 μm2, 371 x 371 μm2 and 302 x 302 μm2
Effective date: 04 May 2025 |
| 2025/05/04 |
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PCN (Product Change Notice)
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Die Design (please see the SQR) - Die shrink from 280 x 280 μm2, 400 x 400 μm2 and 370 x 350 μm2 to 260 x 260 μm2, 371 x 371 μm2 and 302 x 302 μm2 |