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PCN/PDN/NRND Information

PCN (product/process change notification) and PDN (production discontinuation notification) information.

Notification Date Notification Documents Notification Type Notification Information
2025/02/17 PCN(Product Change Notice) Supplier Notice No.:MDG/24/14375#1
Title:
AMKOR ATP (Philippines) TFBGA package copper palladium bonding wire introduction on STM32F4x, STM32F7x, STM32G4x and STM32H7x listed products.

Description of change:
(Updated document)
Old/
Current Wire bonding material:
- MUAR (Malaysia) gold wire
- ASE Kaohsiung (Taiwan) Gold or CuPd wire
- AMKOR ATP (Philippines) gold wire

New/
Current Wire bonding material:
- MUAR (Malaysia) gold wire
- ASE Kaohsiung (Taiwan) Gold or CuPd wire
- AMKOR ATP (Philippines) gold wire
New Wire bonding material :
- AMKOR ATP (Philippines) copper palladium wire

Anticipated Impact on form,fit,function, quality, reliability or processability?
no impact on form, Fit, Function

Intended start of delivery:
2025-02-17
2025/07/03 PCN(Product Change Notice) PCN No.:MICROCONTROLLERS/25/15246
Change Desc.:Generic communication - Enhanced traceability with 2D marking for STM32 and STM8 listed
products(2/3)

old/
Marking composition with no 2D marking

New/
New marking composition with 2D marking for
production assembly
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PCN/PDN/NRND Information
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Notification Information
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