| 2024/08/10 |
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PCN(製品仕様変更通知書)
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IXYS サイリスタおよびダイオード のディスクリートパッケージ製品の新たな エポキシ成型コンパウンド材 EMC が 認証を受け、追加 となります。 |
| 2024/08/10 |
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PCN(製品仕様変更通知書)
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Supplier Notice No.:ESW490-58 Title: Alternative Epoxy Molding Compound for IXYS Brand Thyristor & Diode Discrete Packages
Description of Change: Littelfuse would like to notify you that we have qualified alternative Epoxy Moldi Compound (EMC) material for various IXYS Brand Thyristor & Diode Discrete Packages to serve the Business Continuity Plan (BCP).
Form, fit, function changes: No Fit/Form/Function change with alternative EMC
Effective date: August 10th, 2024 |
| 2026/01/02 |
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PCN(製品仕様変更通知書)
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PCN No.:EPCN-379561 Change Desc.:This letter serves as a notification to inform you that we are improving our packing methodology to eliminate the risk of product contamination by implementing a vacuum-sealed shielded bag.
Form, fit, function changes : No change
Effective date : Jan 2, 2026 |
| 2026/01/02 |
|
PCN(製品仕様変更通知書)
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PCN no.:Littelfuse121025 Change Desc.:This letter serves as a notification to inform you that we are improving our packing methodology to eliminate the risk of product contamination by implementing a vacuum-sealed shielded bag.
Effective date : Jan 2, 2026 |