| 2024/10/21 |
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PCN(製品仕様変更通知書)
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The ENEC marking for some switch product series will be removed due to duplication with existing UL certification. |
| 2025/02/26 |
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PCN(製品仕様変更通知書)
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一部ディスクリートMOSFET、IGBT、マルチチップ、バイポーラ製品の後工程製造において、 新たな代替エポキシモールディングコンパウンド(EMC)を追加いたします。
#: PCN24-138 |
| 2025/02/26 |
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PCN(製品仕様変更通知書)
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Supplier Notice No.:LFPCN-DMI-BTA-2024-00301 Title: Product Change Notification for Littelfuse MOSFET, IGBT, Multichip and Power Bipolar Discrete Devices
DESCRIPTION OF CHANGE: Addition of new alternative epoxy molding compound for discrete MOSFET, IGBT, multichip and bipolar parts shall allow Littelfuse to effectively serve business continuity plan (BCP). The new alternative epoxy molding compound has been qualified for the following packages: TO-262, TO-263, TO-263HV, TO-220, TO-3P, ISO247, TO-247, PLUS247, TO-268, TO-268HV, TO-264, PLUS264 and SOT-227B.
Form, fit, function changes: Littelfuse does not anticipate any change in form/fit/function of the affected part numbers
Affected parts shipped from February 26, 2025, will only be with the new EMC.
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| 2025/02/26 |
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PCN(製品仕様変更通知書)
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Supplier Noatice No.:LFPCN-DMI-BTA-2024-00302 Title: Littelfuse has qualified an alternative epoxy molding compound (EMC), free of dechlorane plus,(Discrete IGBTs)
DESCRIPTION OF CHANGE: Qualification of the new alternative EMC, free of dechlorane plus, for the affected discrete MOSFET, IGBT, multichip and bipolar parts shall allow Littelfuse to effectively serve business continuity plan (BCP). The new alternative EMC has been qualified for the following packages: TO-262, TO-263, TO-263HV, TO-220, TO-3P, ISO247, TO-247, PLUS247, TO-268, TO-268HV, TO-264, PLUS264 and SOT-227B.
Form, fit, function changes: Littelfuse does not anticipate any change in form/fit/function of the affected part numbers.
Affected parts shipped from February 26, 2025, will only be with the new EMC, free of dechlorane plus. |