| 2021/01/08 |
|
PCN（製品仕様変更通知書）
|
PRODUCT / PROCESS CHANGE INFORMATION
MBB (Material Barrier Bag) : extend print out warning message on shelf life
Type of change: Any indirect material modifications for shipping products in dimensions, material, composition, orientation…
(OLD) Due to historical reasons, the MBB ST is providing for SMD (Surface Mount Device) products have printed advise message alerting on 12 months of shelf life in sealed bags.
(NEW) To align with extended shelf life International trends, the print out advise message for SMD products and in any case all products packed with MBB will be changed alerting on 24 months of shelf life in sealed bags. |
| 2021/07/29 |
|
PCN（製品仕様変更通知書）
|
Die redesign: Mask or mask set change with new die design
- Design changes in active elements.
Manufacturing Location
TSMC Fab14 (Taiwan)/ Crolles (France)
Old
Current Die revision:
- STM32F46X 1MB rev2 (Cut 1.3) in ST Crolles CRL300 (France)
- STM32F46X 1MB rev4 (Cut 1.3) in TSMC Fab14 (Taiwan)
Current RM0090 Rev 8 - Reference Manual
STM32F405/415, STM32F407/417, STM32F427/437
and STM32F429/439 advanced ArmR-based 32-bit MCUs
New
New Die Revision to improve manufacturing efficiency:
- STM32F46X 1MB rev6 (Cut 1.4) in ST Crolles CRL300 (France)
- STM32F46X 1MB rev5 (Cut 1.4) in TSMC Fab14 (Taiwan)
New RM0090 Rev 19 - Reference Manual - february 2021
STM32F405/415, STM32F407/417, STM32F427/437
and STM32F429/439 advanced ArmR-based 32-bit MCUs
Timing / schedule
Date of qualification results 2021-05-14
Intended start of delivery 2021-12-22 |
| 2021/08/30 |
|
PCN（製品仕様変更通知書）
|
- Specification Change
OLD
Refer to application Note AN2606 version 48.0 April 2021 :
- STM32F40xxx/41xxx devices in WLCSP90 package have Bootloader version V9.0.
- STM32F40xxx/41xxx devices in all other packages have Bootloader version V3.1.
NEW
Refer to application Note AN2606 version 49.0 July 2021 :
- All STM32F40xxx/41xxx devices in any package with new BootLoader version V9.1 |
| 2021/08/30 |
|
PCN（製品仕様変更通知書）
|
STM32F46X 1MB product BootLoader improvement
Product Category: STM32F46X 1MB
Issue date 2021-07-13
Description
Old
Refer to application Note AN2606 version 48.0 April 2021 :
- STM32F40xxx/41xxx devices in WLCSP90
package have Bootloader version V9.0.
- STM32F40xxx/41xxx devices in all other
packages have Bootloader version V3.1.
New
Refer to application Note AN2606 version 49.0 July 2021 :
- All STM32F40xxx/41xxx devices in any
package with new BootLoader version V9.1
Intended start of delivery 2021-08-30 |
| 2021/08/30 |
|
PCN（製品仕様変更通知書）
|
Specification Change
STM32F46X 1MB product BootLoader improvement
Description
Refer to application Note AN2606 version 49.0 July 2021
- All STM32F40xxx/41xxx devices in any
package with new BootLoader version V9.1
Intended start of delivery 2021-08-30 |
| 2021/12/22 |
|
PCN（製品仕様変更通知書）
|
Die redesign: Mask or mask set change with new die design - Design changes in active elements.
Description of change:
OLD:
Current Die revision:
- STM32F46X 1MB rev2 (Cut 1.3) in ST Crolles CRL300 (France)
- STM32F46X 1MB rev4 (Cut 1.3) in TSMC Fab14 (Taiwan)
Current RM0090 Rev 8 - Reference Manual
STM32F405/415, STM32F407/417,
STM32F427/437 and STM32F429/439 advanced ArmR-based 32-bit MCUs.
New:
New Die Revision to improve manufacturing efficiency:
- STM32F46X 1MB rev6 (Cut 1.4) in ST Crolles CRL300 (France)
- STM32F46X 1MB rev5 (Cut 1.4) in TSMC Fab14 (Taiwan)
New RM0090 Rev 19 - Reference Manual -february 2021
STM32F405/415, STM32F407/417,
STM32F427/437 and STM32F429/439 advanced ArmR-based 32-bit MCUs
Intended start of delivery 2021-12-22 |
| 2022/05/08 |
|
PCN（製品仕様変更通知書）
|
NEW DISTRIBUTION CENTER
Notification related to 2nd EMEA DC project in Frankfurt
Timing / schedule
Intended start of delivery 2022-05-08 |
| 2023/03/21 |
|
PCN（製品仕様変更通知書）
|
ASE KaoHsiung (Taiwan) LQFP 24x24 package copper palladium bonding wire introduction
on STM32F2/F4/F7x and STM32H5/H7x listed products
Timing / schedule Intended start of delivery 2023-03-21 |
| 2023/03/21 |
|
PCN（製品仕様変更通知書）
|
ASE LQFP 24X24 package copper palladium bonnding wire introduction |
| 2024/09/02 |
|
PCN（製品仕様変更通知書）
|
Supplier Notice No.:24/14718
Title:
ASE Kaohsiung Enhanced traceability with 2D marking for LQFP7x7, LQFP10x10, LQFP14x14, LQFP20x20 & LQFP24x24 listed products
Description of change:
Old/Marking composition with no 2D marking
New/New marking composition with 2D marking for production assembly
Motivation:
to enhance traceability
Intended start of delivery:
2024-09-02 |
| 2025/05/20 |
|
PCN（製品仕様変更通知書）
|
ASE KaoHsiung (Taiwan) additional source for legacy STM32F2x, STM32F4x and STM32F7x
Description of change
Old Current assembly sites (depending on package/product):
- ST Muar (Malaysia) Silver wire for Crolles & TSMC Dice,
- AMKOR ATP (Philippine) Gold for Crolles, TSMC & Rousset Dice,
- AMKOR ATP (Philippine) Copper Palladium wire for Crolles, TSMC Dice,
- ASE Kaohsiung (Taiwan) Gold wire for Crolles, TSMC & Rousset Dice,
- ASE Kaohsiung (Taiwan) Copper Palladium wire for Crolles & TSMC Dice,
- JSCC (China) Gold for Crolles, TSMC & Rousset Dice,
- JSCC (China) Copper Palladium wire for Crolles, TSMC Dice.
You may refer to 15271_Additional
information.pdf document for further details.
New Current assembly sites: (depending on package/product):
- ST Muar (Malaysia) Silver wire for Crolles & TSMC Dice,
- AMKOR ATP (Philippine) Gold for Crolles, TSMC & Rousset Dice,
- AMKOR ATP (Philippine) Copper Palladium wire for Crolles, TSMC Dice,
- ASE Kaohsiung (Taiwan) Gold wire for Crolles, TSMC & Rousset Dice,
- ASE Kaohsiung (Taiwan) Copper Palladium wire for Crolles & TSMC Dice,
- JSCC (China) Gold for Crolles, TSMC & Rousset Dice,
- JSCC (China) Copper Palladium wire for Crolles, TSMC Dice.
Additional assembly site for extended capacity:
- ASE Kaohsiung (Taiwan) Copper Palladium wire for Rousset Dice.
|
| 2025/09/02 |
|
PCN（製品仕様変更通知書）
|
ASE Kaohsiung Enhanced traceability with 2D marking for LQFP7x7, LQFP10x10, LQFP14x14, LQFP20x20 & LQFP24x24 listed products |
| 2025/09/02 |
|
PCN（製品仕様変更通知書）
|
Supplier Notice No.:MDG/24/14718
Title:
ASE Kaohsiung Enhanced traceability with 2D marking for LQFP7x7, LQFP10x10, LQFP14x14,LQFP20x20 & LQFP24x24 listed products
Description of change:
Old/
Marking composition with no 2D marking
New/
New marking composition with 2D marking for production assembly
Motivation:
to enhance traceability
Anticipated Impact on form,fit,function, quality, reliability or processability?
Form: Change is visible on marking area
Fit : No change
Function : No change
Reliability : No change
Processability : No change
Intended start of delivery:
2025-09-02
|
| 2026/01/05 |
|
PCN（製品仕様変更通知書）
|
PDN No.: EMBEDDED PROCESSING/25/15429
Description: ASE KaoHsiung (Taiwan) LQFP24x24 standardized package introduction on STM32F2x/F4x/F7x and STM32H5x listed products. |
