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PCN/PDN/NRND情報

PCN(製品/プロセス変更通知)およびPDN(生産中止案内)情報です。

通知年月日 通知文書 通知種別 通知情報
2021/01/08 PCN(製品仕様変更通知書) PRODUCT / PROCESS CHANGE INFORMATION
MBB (Material Barrier Bag) : extend print out warning message on shelf life
Type of change: Any indirect material modifications for shipping products in dimensions, material, composition, orientation…
(OLD) Due to historical reasons, the MBB ST is providing for SMD (Surface Mount Device) products have printed advise message alerting on 12 months of shelf life in sealed bags.
(NEW) To align with extended shelf life International trends, the print out advise message for SMD products and in any case all products packed with MBB will be changed alerting on 24 months of shelf life in sealed bags.
2021/03/11 PCN(製品仕様変更通知書) AMKOR ATP (Philippines) enhanced Die Attach (new material) - All listed product in UFBGA package
2021/06/15 PCN(製品仕様変更通知書) Old> marking composition with no SS marking
New> marking composition with additional SS marking
2022/03/31 PCN(製品仕様変更通知書) Wire Bond Method/Material Change
Description of change
Old: ASE Kaohsiung back-end: - Gold wire bonding assembly line
New: ASE Kaohsiung back-end :- Gold wire bonding assembly line
- New Copper Palladium added assembly line
Intended start of delivery 2022-03-31
2022/05/08 PCN(製品仕様変更通知書) NEW DISTRIBUTION CENTER
Notification related to 2nd EMEA DC project in Frankfurt
Timing / schedule
Intended start of delivery 2022-05-08
2024/10/09 PCN(製品仕様変更通知書) Description of change
Old : Current Wire bonding material:
- AMKOR ATP (Philippines) gold wire
- ASE Kaohsiung (Taiwan) gold and Copper Palladium wire.
New : Current Wire bonding material:
- AMKOR ATP (Philippines) gold wire
- ASE Kaohsiung (Taiwan) gold and Copper Palladium wire.
New Wire bonding material :
- AMKOR ATP (Philippines) copper palladium wire

Timing / schedule Intended start of delivery 2024-12-16
2025/01/15 PCN(製品仕様変更通知書) Supplier Notice No.:PCI MDG/24/15095
Title:
AMKOR ATP (Philippines) Enhanced traceability with 2D marking for UFBGA7x7 and UFBGA10x10 listed products ? (Addendum to PCN14374)

Description of change:
Old/
Marking composition with no 2D marking
New/
New marking composition with 2D marking for production assembly

Anticipated Impact on form,fit,function, quality, reliability or processability?
Form: Change is visible on marking area
Fit : No change
Function : No change
Reliability : No change
Processability : No change

Intended start of delivery:
2025-01-15
2025/07/03 PCN(製品仕様変更通知書) PCN No.:MICROCONTROLLERS/25/15246
Change Desc.:Generic communication - Enhanced traceability with 2D marking for STM32 and STM8 listed
products(3/3)

old/
Marking composition with no 2D marking

New/
New marking composition with 2D marking for
production assembly
2025/11/04 PCN(製品仕様変更通知書) Supplier Notice No.:MICROCONTROLLERS/25/15305
Title:ST ROUSSET (France) additional source for STM32F411x , STM32F412x and STM32F76x/F77x listed products in M10/90nm technology.

Type of change:
Line transfer for a full process or process brick(process step, control plan, recipes) from one site to another site: Wafer fabrication (SOP 2617)

Manufacturing Location:
ST Rousset (France)

Anticipated Impact on form,fit, function, quality, reliability or processability?
No change on Form, Fit or Function - same datasheets

Intended start of delivery:
2025-11-04
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   12345  最後  次へ
該当件数 4,672 件中 1 ~ 25 件を表示






   12345  最後  次へ
該当件数 4,672 件中 1 ~ 25 件を表示