| 2021/01/08 |
|
PCN（製品仕様変更通知書）
|
PRODUCT / PROCESS CHANGE INFORMATION
MBB (Material Barrier Bag) : extend print out warning message on shelf life
Type of change: Any indirect material modifications for shipping products in dimensions, material, composition, orientation…
(OLD) Due to historical reasons, the MBB ST is providing for SMD (Surface Mount Device) products have printed advise message alerting on 12 months of shelf life in sealed bags.
(NEW) To align with extended shelf life International trends, the print out advise message for SMD products and in any case all products packed with MBB will be changed alerting on 24 months of shelf life in sealed bags. |
| 2022/05/08 |
|
PCN（製品仕様変更通知書）
|
NEW DISTRIBUTION CENTER
Notification related to 2nd EMEA DC project in Frankfurt
Timing / schedule
Intended start of delivery 2022-05-08 |
| 2023/05/15 |
|
PCN（製品仕様変更通知書）
|
ASE KaoHsiung (Taiwan) LQFP7x7, LQFP10x10, LQFP14x14 and LQFP20x20 package
copper palladium bonding wire introduction on STM32F2/F4/F7x, STM32G0/G4x, STM32L4/L5x
and STM32H5/H7x listed products
Timing / schedule Intended start of delivery 2023-05-15 |
| 2023/05/16 |
|
PCN（製品仕様変更通知書）
|
ASE KaoHsiung (Taiwan) additional source - PCN10689 information alignment
- Second level interconnect (e4) or
Lead finishing material information actualized for AMKOR ATP (Philippines)
for LQFP 100 14x14 package products |
| 2023/06/20 |
|
PCN（製品仕様変更通知書）
|
AMKOR ATP (Philippines) LQFP100 14x14 and LQFP144 20x20 Copper wire introduction and
standardization to post plated leadframes on listed products
Old: gold wire bonding Pre-plated leadframes (PPF)
New: copper palladium wire bonding post plated leadframe (DR) |
| 2024/09/02 |
|
PCN（製品仕様変更通知書）
|
Supplier Notice No.:24/14718
Title:
ASE Kaohsiung Enhanced traceability with 2D marking for LQFP7x7, LQFP10x10, LQFP14x14, LQFP20x20 & LQFP24x24 listed products
Description of change:
Old/Marking composition with no 2D marking
New/New marking composition with 2D marking for production assembly
Motivation:
to enhance traceability
Intended start of delivery:
2024-09-02 |
| 2025/02/28 |
|
PCN（製品仕様変更通知書）
|
ST Crolles (France) additional source for STM32G41x/G47x/G48x, STM32L43x/L44x/L4Zx and STM32L47x/L48x products in M10/90nm technology. |
| 2025/07/03 |
|
PCN（製品仕様変更通知書）
|
PCN No.:MICROCONTROLLERS/25/15246
Change Desc.:Generic communication - Enhanced traceability with 2D marking for STM32 and STM8 listed
products(3/3)
old/
Marking composition with no 2D marking
New/
New marking composition with 2D marking for
production assembly |
| 2025/09/02 |
|
PCN（製品仕様変更通知書）
|
ASE Kaohsiung Enhanced traceability with 2D marking for LQFP7x7, LQFP10x10, LQFP14x14, LQFP20x20 & LQFP24x24 listed products |
| 2025/09/02 |
|
PCN（製品仕様変更通知書）
|
Supplier Notice No.:MDG/24/14718
Title:
ASE Kaohsiung Enhanced traceability with 2D marking for LQFP7x7, LQFP10x10, LQFP14x14,LQFP20x20 & LQFP24x24 listed products
Description of change:
Old/
Marking composition with no 2D marking
New/
New marking composition with 2D marking for production assembly
Motivation:
to enhance traceability
Anticipated Impact on form,fit,function, quality, reliability or processability?
Form: Change is visible on marking area
Fit : No change
Function : No change
Reliability : No change
Processability : No change
Intended start of delivery:
2025-09-02
|
| 2025/12/01 |
|
PCN（製品仕様変更通知書）
|
生産場所の追加 ③追加
①協力会社 Ａ社
②ヒロセ電機㈱ 郡山工場
③ヒロセ電機㈱ インドネシア工場
|
| 2026/03/25 |
|
PCN（製品仕様変更通知書）
|
PCN No. EMBEDDED PROCESSING/25/15917
Change Desc.
Old
- ASE Kaohsiung (Taiwan) Gold wire & Copper Palladium wire
- AMKOR ATP (Philippine) Gold wire & Copper Palladium wire
New
- ASE Kaohsiung (Taiwan) Gold wire & Copper Palladium wire
- AMKOR ATP (Philippine) Gold wire & Copper Palladium wire
Additional assembly site for extended capacity:
- ST Muar (Malaysia) Copper Alloy wire
Intended start of delivery 2026-03-25
|
